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Electronic Devices Square Metal Metal Glaze Coated Resistor

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APPLICABLE SCOPE :

1.1 This specification is for use in METAL GLAZE FILM RESISTORS

1.2 Characteristics and Specifications are according to those of : MIL-STD-105  MIL-STD-202  JIS C 5201 GB 5731-85  IEC 115-2-1-1982  QC 400101

TYPELDdPW1W2
MG256.0±1.02.3±0.50.40±0.055±0.352±1.564±1.5
MG509.0±1.03.2±0.50.48±0.055±0.352±1.564±1.5
MG10011.0±1.04.0±0.50.55±0.055±0.352±1.564±1.5
MG20015.5±1.05.0±0.50.75±0.0510±0.373±1.585±1.5


DESCRIPTION

MG-25MG-50MG-100MG-200
STANDARD   RESISTANCE   VALUE   RANGE

102-39MΩ10Ω-39MΩ10Ω-39MΩ10Ω-39MΩ
POWER RATINGAT 70℃

1/4W1/2W1W2W
MAX       WORKINGVOLTAGE

500V700V700V1000V
MAX    OVERLOAD    VOLTAGE

700V1000V1000V1500V
OPERATING    TEMPERATURE    RANGE

-55℃~+155℃-55℃~+155℃55℃~+155℃55℃~+155℃
TEMPERATURE     COEFFICIENT

+500PPM±500PPM+500PPM+500PPM
TEMPERATURE     CYCLING

±(1%R+0.05Ω)±(1%R+0.05Ω)±(1%R+0.05Ω)±(1%R+0.05Ω)
INSULATION RESISTANCE

MIN.1,000 MΩMIN.1,000 MΩMIN.1,000 MΩMIN.1,000 MΩ
HUMIDITY

±(5%R+0.12)±(5%R+0.1Ω)±(5%R+0.12)±(5%R+0.12)
SHORT-TIME     OVERLOAD

±(2.5%R+0.052)±(2.5%R+0.05Ω)±(2.5%R+0.052)±(2.5%R+0.05(2)
SOLDERABILITY

MIN.80%COVEREDMIN.80%COVEREDMIN.80%COVEREDMIN.80%COVERED
VIBRATION

±(1.5%R+0.052)±(1.5%R+0.05Ω)±(1.5%R+0.05Ω)±(1.5%R+0.05Ω)
LOADLIFE

±(5%R+0.15Ω)±(5%R+0.15Ω)±(5%R+0.15Ω)±(5%R+0.15Ω)
No:ItemsCharacteristics
Test methods
1
Resistance Value
ClassJ(±5%)
JIS-C-52025.1
Classification of applied A
2Temperature Coefficient of

Resistance
±500ppm/℃JIS-C-52025.2

Measured at room Temperature and
room Temperature+100℃
3
Short-time Overload
Resistance change within

±(0.5%+0.05Ω)

JIS-C-52025.5
(rated voltage x2.55s)
4
Endurance
(under damp and load)
Resistance change within

±(5.0%+0.1Ω)
JIS-C*52027.9

1)test temperature.40℃ ±2℃

2)relative humidity 90%-95%

3)duration 1000 hours
5Endurance (rated load)Resistance change within

±(1.5%+0.1Ω)

JIS-C-52027.10
1)test temperature70℃ ±3℃

2)duration 1000 hours
6
Resistance to
Soldering heat
Resistance change within

±(1.0%+0.05Ω)
JIS-C-52026.4
1)Temp of solder 260 ℃±10℃

2)duration of immersion

10s±0.5 s
7Solder ability95%(min)coverageJIS-C-52026.5

1)Temp of solder 260 ℃±5℃

2)duration of immersion

2 s+0.5s

3)preparation not applicable
8Temperature cyclingResistance change within

±(1.0%+0.05Ω)
JIS-C-52027.4

1)Test temp.-55℃~+155℃

2)number of 5 cycles
9Dielectric
Withstanding
Voltage
Flash over,burning,,

Insulation damage should

Not be observed
JIS-C-52025.7
1)V-Block
2)test voltage 500 V
3)duration time 60 s
No:Items
Characteristics

Test   methods
10
Resistance

To cold
Resistance change within ±

(1.0%+0.05Ω)
1)JIS-C-52027.1

1)test temp.-55℃±3℃

duration 24hours
11

Resistance to damp heat


Resistance change within

±(2%+0.05Ω)
JIS-C-52027.5
1)test temp.40℃ ±2℃

2)relative humidity 90%-95%

duration 240 hours
12
Insulation resistance

More than >1,000MΩ

JIS-C52025.6
Test voltage DC 500V ±10V
13Tensile strengthNeither breakage of the lead wire

nor loosening of termination
resistance change within

±(0.5%+0.05Ω)
JIS-C-52026.1.1(1)
Comply with 6.1 and 6.1.2(1).
14
Intermittent overload
Resistance change within

±(1.0%+0.05Ω)
JIS-C-52025.8
1)applicable more than 100Ω

2)rated voltagex4

3)10,000 cycles
15Bending strengthNeither breakage of the lead wire

nor loosening of termination
resistance change within
±(0.5%+0.05Ω)
JIS-C-52026.1.2(4)

Comply with 6.land 6.1.2 (4)carry

out on the same specimen
immediately after tensile strength test
of 6.1.2(1)
16Pulse withstanding

voltage
Resistance change withinThe following discharge cycle is
repeated in the circuit of the left fig
2.5 sec.ON 2.5 sec OFF10 cycles.

Test voltage (DC source)

<100KQ:3KV

100K~620KΩ:5KV

>620KΩ:10KV
+20%test


M
circuit

10KΩ
SX

 〇
DC

  0.001μF     RX


SOURCE


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