HKR products comply with environmental requirement in accordance with SONY of code no. SS-00259 for not related in 10 harmful materials.
Features
Small size and ligtweight with size range per int'l standard
Highly stable in auto-placement surface mounting application
Compatible with both wave soldering and reflow soldering
Excellent Solderability and Terminal bending capacity,especially suitable for LED and the field of flexible circuit board
Size | L(mm) | W(mm) | T(mm) | C (mm) | D |
0603 | 1.60±0.10 | 0.80±0.10 | 0.45±0.10 | 0.25±0.15 | 0.30±0.15 |
0805 | 2.00±0.10 | 1.25±0.10 | 0.50±0.10 | 0.35±0.20 | 0.40±0.20 |
1206 | 3.10±0.10 | 1.55±0.10 | 0.55±0.10 | 0.45±0.20 | 0.60±0.40 |
1210 | 3.10±0.10 | 2.50±0.10 | 0.55±0.10 | 0.45±0.25 | 0.45±0.25 |
Type | LED03 | LED05 | LED06 | LED10 |
Size | 0603 | 0805 | 1206 | 1210 |
Power Rating at 70℃ | 1/10W | 1/8W | 1/4W | 1/3W |
Max RCWV | 50V | 150V | 200V | 200V |
Max Overload Voltage | 100V | 300V | 400V | 400V |
±5%(E-24) Standard Resistance Range | [OO~1OK | 10S~10KS | 10Q~10KQ | 10R~330R |
Operating Temperature Range | -55~+155℃ |
The working voltage is calculated based on the resistance value following the formula of V=√(P*R) or to its maximum extent as indicated above.
The overload voltage is calculated based on the resistance value following the formula of V=2.5√(P*R) or to its maximum extent as indicated above.
ITEM | SPECIFICATION | TESTMETHOD |
Solderability | Over 95%of termination must be covered with solder | JIS C 52014.17/MIL-STD-202GMETHOD 208H/ IEC 60115-14.17 Reflow Soldering:Bath temperature:(235±5)℃,Immersion time:(2±0.5)s WAVE Soldering:Bath temperature:(270±10)℃,Immersion time:(2±0.5)s |
Resistance to Solder Heat | △R≤±(1%+0.05Ω) No mechanical damage | JISC52014.18/MIL-STD-202GMETHOD210F/IEC 60115-1 4.18 The temperature of the solder bath shall be (260±5)℃,The immersion time shall be(5±0.5)s or(10±1)s as prescribed by the detail specification |
Temperature Coefficient of Resistance (TCR) | 19~10Q;>1M:±200ppm/℃ 10Q(excluding10Ω)~1M: ±100ppm/℃ | JISC52014.8/MIL-STD-202G METHOD 304/IEC60115-14.8 The temperature characteristic or temperature coefficient of resistance is not specified for resistance values of less than 5R owing to difficulty of accurate measurement |
Short time Overload | △R≤±(2%+0.05Ω) | JISC 52014.13/EC 60115-14.13 2.5×Rated voltage or Max.Overload Voltage for 5 sec. measure resistance after 30 minutes |
Load Life Humidity | △R≤±(3%+0.05Ω) | JISC52014.24/MIL-STD-202G Method 106G/IEC 60115-14.24 Maintain the temperature of the resistor at 40±2℃ and 90~95%RH with the rated voltage applied.Cycle ON for 1.5 hours and OFF for 0.5 hour for1000+48/-0 hours.After 1~4 hour,measure the resistance value. |
Load Life | △R≤±(3%+0.052) | JISC52014.25/MIL-STD-202G Method 108A/IEC 60115-14.25 70±2℃,Max.working voltage for 1000 hrs with 1.5 hrs"ON"and 0.5 hrs"OFF". |
JISC52014.19/MIL-STD-202G Method 107G/EC 60115-14.19 | ||
Temperature | △R≤±(3%+0.05Ω) | Repeat 5 cycles as follows -65℃(30 min.)+25℃(2~3 min.)+125℃(30 |
Cycle | min.)+25℃(2~3 min.) | |
Insulation Resistance | Between termination and coating must be over 1000MQ | JIS C 52014.6/MIL-STD-202G Method 302/IEC 60115-14.6 Test voltage:100±15V |
Bending Strength | △R≤±(1%+0.05Ω) No mechanical damage | JISC52014.33/MIL-STD-202G Method 211A/IEC60115-14.33 Resistance change after bended on the 90mm PCB. Bend:3mm for 0603、0805、1206 2mm for 1210 |
HKR products comply with environmental requirement in accordance with SONY of code no. SS-00259 for not related in 10 harmful materials.
Features
Small size and ligtweight with size range per int'l standard
Highly stable in auto-placement surface mounting application
Compatible with both wave soldering and reflow soldering
Excellent Solderability and Terminal bending capacity,especially suitable for LED and the field of flexible circuit board
Size | L(mm) | W(mm) | T(mm) | C (mm) | D |
0603 | 1.60±0.10 | 0.80±0.10 | 0.45±0.10 | 0.25±0.15 | 0.30±0.15 |
0805 | 2.00±0.10 | 1.25±0.10 | 0.50±0.10 | 0.35±0.20 | 0.40±0.20 |
1206 | 3.10±0.10 | 1.55±0.10 | 0.55±0.10 | 0.45±0.20 | 0.60±0.40 |
1210 | 3.10±0.10 | 2.50±0.10 | 0.55±0.10 | 0.45±0.25 | 0.45±0.25 |
Type | LED03 | LED05 | LED06 | LED10 |
Size | 0603 | 0805 | 1206 | 1210 |
Power Rating at 70℃ | 1/10W | 1/8W | 1/4W | 1/3W |
Max RCWV | 50V | 150V | 200V | 200V |
Max Overload Voltage | 100V | 300V | 400V | 400V |
±5%(E-24) Standard Resistance Range | [OO~1OK | 10S~10KS | 10Q~10KQ | 10R~330R |
Operating Temperature Range | -55~+155℃ |
The working voltage is calculated based on the resistance value following the formula of V=√(P*R) or to its maximum extent as indicated above.
The overload voltage is calculated based on the resistance value following the formula of V=2.5√(P*R) or to its maximum extent as indicated above.
ITEM | SPECIFICATION | TESTMETHOD |
Solderability | Over 95%of termination must be covered with solder | JIS C 52014.17/MIL-STD-202GMETHOD 208H/ IEC 60115-14.17 Reflow Soldering:Bath temperature:(235±5)℃,Immersion time:(2±0.5)s WAVE Soldering:Bath temperature:(270±10)℃,Immersion time:(2±0.5)s |
Resistance to Solder Heat | △R≤±(1%+0.05Ω) No mechanical damage | JISC52014.18/MIL-STD-202GMETHOD210F/IEC 60115-1 4.18 The temperature of the solder bath shall be (260±5)℃,The immersion time shall be(5±0.5)s or(10±1)s as prescribed by the detail specification |
Temperature Coefficient of Resistance (TCR) | 19~10Q;>1M:±200ppm/℃ 10Q(excluding10Ω)~1M: ±100ppm/℃ | JISC52014.8/MIL-STD-202G METHOD 304/IEC60115-14.8 The temperature characteristic or temperature coefficient of resistance is not specified for resistance values of less than 5R owing to difficulty of accurate measurement |
Short time Overload | △R≤±(2%+0.05Ω) | JISC 52014.13/EC 60115-14.13 2.5×Rated voltage or Max.Overload Voltage for 5 sec. measure resistance after 30 minutes |
Load Life Humidity | △R≤±(3%+0.05Ω) | JISC52014.24/MIL-STD-202G Method 106G/IEC 60115-14.24 Maintain the temperature of the resistor at 40±2℃ and 90~95%RH with the rated voltage applied.Cycle ON for 1.5 hours and OFF for 0.5 hour for1000+48/-0 hours.After 1~4 hour,measure the resistance value. |
Load Life | △R≤±(3%+0.052) | JISC52014.25/MIL-STD-202G Method 108A/IEC 60115-14.25 70±2℃,Max.working voltage for 1000 hrs with 1.5 hrs"ON"and 0.5 hrs"OFF". |
JISC52014.19/MIL-STD-202G Method 107G/EC 60115-14.19 | ||
Temperature | △R≤±(3%+0.05Ω) | Repeat 5 cycles as follows -65℃(30 min.)+25℃(2~3 min.)+125℃(30 |
Cycle | min.)+25℃(2~3 min.) | |
Insulation Resistance | Between termination and coating must be over 1000MQ | JIS C 52014.6/MIL-STD-202G Method 302/IEC 60115-14.6 Test voltage:100±15V |
Bending Strength | △R≤±(1%+0.05Ω) No mechanical damage | JISC52014.33/MIL-STD-202G Method 211A/IEC60115-14.33 Resistance change after bended on the 90mm PCB. Bend:3mm for 0603、0805、1206 2mm for 1210 |