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200 Ohm High Power Bluetooth Smd Resistor

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200 Ohm High Power Bluetooth Smd Resistor
200 Ohm High Power Bluetooth Smd Resistor
200 Ohm High Power Bluetooth Smd Resistor
200 Ohm High Power Bluetooth Smd Resistor
200 Ohm High Power Bluetooth Smd Resistor
200 Ohm High Power Bluetooth Smd Resistor

Features

-Small size and light weight

—Highly reliable multilayer electrode construction-Compatible with all soldering process


Applications

-Telecommunication Equipments

-Radio and Tape Recorders,TV Tuners

-Digital Cameras,Watches,Pocket Calculators—Automotive Industry-Computers,Instruments—Medical and Military Equipment


Dimensions                                         Unit: mm

TypeLWTD1D2
FPF021.00±0.050.50±0.050.35±0.050.20±0.100.20±0.10
FPF031.60±0.100.80±0.100.45±0.150.30±0.200.30±0.20
FPF052.00±0.101.25±0.100.50±0.150.35±0.200.40±0.20
FPF063.10±0.101.55±0.100.55±0.150.50±0.200.50±0.20
FPF103.10±0.102.60±0.500.55±0.100.50±0.250.50±0.20
FPF205.00±0.202.50±0.200.55±0.200.60±0.250.50±0.25
FPF256.35±0.203.10±0.200.55±0.200.60±0.250.50±0.25
High Power &UItra High Power Rating Electrical Specifications

          ltem


Type
Power Rating

at 70℃
Operating Temp.

Range
Max.

Operating

Voltage
Max.

Overload
Voltage
TCR (PPM/℃)
Resistance

Tolerance
(±1%)(±5%)
FPF02(0402)1/10W-55~+155℃50V100V1~9.92±400ppm±400ppm
FPF03(0603)1/8W50V100V
FPF05 (0805)1/4W150V300V
10~1M2±100ppm±200ppm
FPF06(1206)1/3* 1/2W200V400V
FPF10(1210)1/2*2/3*3/4W200V400V
1.01M~10MΩ±200ppm±200ppm
FPF20(2010)3/4*1W200V400V
FPF25 (2512)1.5 *2W250V500V

Environmental Characteristics

ItemRequirementTest    Method
±1% and Below±5%Jumper
Temperature Coefficient of
Resistance(T.C.R.)
As   SpecJIS C 5201-14.8
IEC  60115-14.8
-55℃~+125℃,25℃ is the reference temperature
Short Time Overload±(1.0%+0.05Ω)±(2.0%+0.05Ω) <50mΩJIS C 5201-14.13
IEC  60115-14.13
2.5 times RCWV or Max. overload voltage for 5 seconds
Insulation   Resistance>10GQJIS C 5201-14.6
IEC  60115-14.6
Max. overload voltage for 1 minute
Endurance±(2.0%+0.1Ω)±(3.0%+0.12)<100mΩJIS C 5201-14.25
IEC 60115-14.25.1
70±2°C, Max. working voltage for 1000 hrs with 1.5 hrs
"ON"and 0.5 hrs"OFF"
Damp  Heat  with  Load±(2.0%+0.1Ω)±(3.0%+0.1Ω)<100mΩJIS C 5201-14.24
40±2°C, 90~95% R.H., Max. working voltage for 1000
hrs with 1.5 hrs"ON" and 0.5 hrs"OFF"
Dry   Heat±(1.0%+0.1Ω)±(1.5%+0.1Ω)<50mΩJIS C 5201-14.23.2
IEC 60115-12.23.2
at +155°℃ for 1000 hrs
Bending   Strength±(1.0%+0.05Ω)±(1.0%+0.05Ω)<50mΩJIS C 5201-14.33
JIEC  60115-14.33
Bending once for 5 seconds with 3mm
20102512 sizes: 2 mm
Solderability95%min.     coverageJIS C 5201-14.17
IEC  60115-14.17
245±5℃ for 3 seconds
Resistance  to  Soldering  heat±(0.5%+0.052)±(1.0%+0.05Ω)<50mΩJIS C 5201-14.18
IEC  60115-14.18
260±5℃ for 10 seconds
Voltage   ProofNo breakdown or flashoverJIS C 5201-14.7
IEC  60115-14.7
1.42 times RCWV (RMS) for 1 minute
LeachingIndividual leaching area ≤5%
Total leaching area ≤10%
JIS C 5201-14.18
IEC 60068-2-588.2.1
260±5°C for 30 seconds
Rapid   Change   of   Temperature±(0.5%+0.05Ω)±(1.0%+0.05Ω)<50mΩJIS C 5201-14.19
IEC  60115-14.19
55℃ to+155°C, 5 cycles
Storage Temperature:25±3℃;Humidity<80%RH






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