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Our products are to comply with environmental requirements in accordance with SONY code no. SS-00259 withrestrictions of 10 harmful materials.
Features ‧ Small size and light weight with size range per international standard ‧ Highly stable in auto-placementsurface mounting application ‧ Compatible with both wave soldering and reflow soldering.
| Size | L | W | T | C | D |
| 0201 | 0.60±0.03 | 0.30±0.03 | 0.23±0.03 | 0.15±0.05 | 0.15±0.05 |
| 0402 | 1.00±0.10 | 0.50±0.05 | 0.35±0.05 | 0.20±0.10 | 0.25±0.10 |
| 0603 | 1.60±0.10 | 0.80±0.10 | 0.45±0.10 | 0.25±0.15 | 0.30±0.15 |
| 0805 | 2.00±0.10 | 1.25±0.10 | 0.50±0.10 | 0.35±0.20 | 0.40±0.20 |
| 1206 | 3.10±0.10 | 1.55±0.10 | 0.55±0.10 | 0.45±0.20 | 0.40±0.20 |
| 1210 | 3.10±0.10 | 2.50±0.10 | 0.55±0.10 | 0.45±0.25 | 0.45±0.25 |
| 1218 | 3.10±0.10 | 4.60±0.10 | 0.55±0.10 | 0.45±0.25 | 0.45±0.25 |
| 1812 | 4.50±0.10 | 3.10±0.20 | 0.55±0.05 | 0.55±0.20 | 0.70±0.20 |
| 2010 | 5.00±0.20 | 2.50±0.15 | 0.55±0.10 | 0.60±0.25 | 0.50±0.25 |
| 1225 | 3.10±0.15 | 6.30±0.15 | 0.90±0.15 | 0.60±0.30 | 0.80±0.25 |
| 2512 | 6.35±0.20 | 3.10±0.15 | 0.55±0.10 | 0.60±0.25 | 0.60±0.25 |
Type | RCT01 | RCT02 | RCTO3 | RCT05 | RCT06 | RCT10 | RCT20 | RCT25 | |
Size | 0201 | 0402 | 0603 | 0805 | 1206 | 1210 | 2010 | 2512 | |
Power Rating at 70℃ | 1/20W | 1/16W | 1/10W | 1/8W | 1/4W | 1/3W | 3/4W | 1W | |
Max RCWV | 25V | 50V | 75V | 150V | 200V | 200V | 200V | 200V | |
Max Overload Voltage | 50V | 100V | 150V | 300V | 400V | 500V | 500V | 500V | |
Jumper<50m ohm | 0.5A | 1A | 1A | 2A | 2A | 2A | 2A | 2A | |
Operating Temperature Range | -55~+155℃ | ||||||||
Standard Resistance Range | 0Ω | 0~50mOhm | |||||||
| ±1%(E-96) | 1ohm~10M ohm | 1ohm~10M ohm | |||||||
| ±5%(E-24) | 1ohm~10M ohm | 1ohm~22M ohm | |||||||
| ITEM | SPECIFICATIONS | TEST METHOD |
Solderability | Over 95%of termination must be covered with solder | JISC52014.17/MIL-STD-202G METHOD 208H/ IEC 60115-14.17 Reflow Soldering:Bath temperature:(235±5)℃,Immersion time:(2±0.5)s WAVE Soldering:Bath temperature:(270±10)℃,Immersion time:(2±0.5)s |
Resistance to Solder Heat | J:△R≤±(1%+0.05Ω) F:△R≤±(0.5%+0.05Ω) No mechanical damage | JISC52014.18/MIL-STD-202GMETHOD 210F/ IEC 60115-14.18 The temperature of the solder bath shall be (260±5)℃,The immersion time shall be(5±0.5)s or(10±1)s as prescribed by the detail specification |
Temperature Coefficient of Resistance (TCR) | (0402&0201): 1Q~10Ω;>3.3M:±400ppm/℃ 10Ω(excluding 10Ω)~3.3M: ±200ppm/℃ (0603 or above): 1Q~10Ω;>1M:±200ppm/℃ 10Ω(excluding10Ω)~1M: ±100ppm/℃ | JISC52014.8/MIL-STD-202G METHOD 304/ IEC 60115-14.8 The temperature characteristic or temperature coefficient of resistance is not specified for resistance values of less than 5R owing to difficulty of accurate measurement |
Short Time Overload | J:△R≤±(2%+0.05Ω) F:△R≤±(1%+0.052) | JISC52014.13/IEC 60115-14.13 2.5×Rated voltage or Max.Overload Voltage for 5 sec. measure resistance after 30 minutes |
Load Life Humidity | J:△R≤±(3%+0.05Ω) F:△R≤±(1%+0.05Ω) | JISC52014.24/MIL-STD-202G Method 106G/ IEC 60115-14.24 Maintain the temperature of the resistor at 40±2℃ and 90～95% RH with the rated voltage applied.Cycle ON for 1.5 hours and OFF for 0.5 hour for1000+48/-0 hours.After 1～4 hour,measure the resistance value. |
Load Life | J:△R≤±(3%+0.05Ω) F:△R≤±(1%+0.05Ω) | JISC52014.25/MIL-STD-202G Method 108A/ IEC 60115-14.25 70±2℃,Max.working voltage for 1000 hrs with 1.5 hrs "ON"and 0.5 hrs “OFF". |
Temperature Cycle | J:△R≤±(1%+0.05Ω) F:△R≤±(0.5%+0.05Ω) No mechanical damage | JISC52014.19/MIL-STD-202G Method 107G/ IEC 60115-14.19 Repeat 5 cycles as follows -65℃(30 min.)+25℃(2～3 min.)+125℃ (30 min.)+25℃(2～3 min.) |
Insulation Resistance | Between termination and coating must be over 1000MQ | JISC52014.6/MIL-STD-202G Method 302/ IEC 60115-14.6 Test voltage:100±15V |
| JISC52014.33/MIL-STD-202G Method 211A/ | ||
| J:△R≤±(1%+0.05Ω) | IEC 60115-14.33 | |
| Bending | F:△R≤±(0.5%+0.05Ω) | Resistance change after bended on the 90mm PCB. |
| Strength | No mechanical damage | Bend:3mm for 0201、0402、0603、0805、1206、1210 2mm for 2010、2512 |
Our products are to comply with environmental requirements in accordance with SONY code no. SS-00259 withrestrictions of 10 harmful materials.
Features ‧ Small size and light weight with size range per international standard ‧ Highly stable in auto-placementsurface mounting application ‧ Compatible with both wave soldering and reflow soldering.
| Size | L | W | T | C | D |
| 0201 | 0.60±0.03 | 0.30±0.03 | 0.23±0.03 | 0.15±0.05 | 0.15±0.05 |
| 0402 | 1.00±0.10 | 0.50±0.05 | 0.35±0.05 | 0.20±0.10 | 0.25±0.10 |
| 0603 | 1.60±0.10 | 0.80±0.10 | 0.45±0.10 | 0.25±0.15 | 0.30±0.15 |
| 0805 | 2.00±0.10 | 1.25±0.10 | 0.50±0.10 | 0.35±0.20 | 0.40±0.20 |
| 1206 | 3.10±0.10 | 1.55±0.10 | 0.55±0.10 | 0.45±0.20 | 0.40±0.20 |
| 1210 | 3.10±0.10 | 2.50±0.10 | 0.55±0.10 | 0.45±0.25 | 0.45±0.25 |
| 1218 | 3.10±0.10 | 4.60±0.10 | 0.55±0.10 | 0.45±0.25 | 0.45±0.25 |
| 1812 | 4.50±0.10 | 3.10±0.20 | 0.55±0.05 | 0.55±0.20 | 0.70±0.20 |
| 2010 | 5.00±0.20 | 2.50±0.15 | 0.55±0.10 | 0.60±0.25 | 0.50±0.25 |
| 1225 | 3.10±0.15 | 6.30±0.15 | 0.90±0.15 | 0.60±0.30 | 0.80±0.25 |
| 2512 | 6.35±0.20 | 3.10±0.15 | 0.55±0.10 | 0.60±0.25 | 0.60±0.25 |
Type | RCT01 | RCT02 | RCTO3 | RCT05 | RCT06 | RCT10 | RCT20 | RCT25 | |
Size | 0201 | 0402 | 0603 | 0805 | 1206 | 1210 | 2010 | 2512 | |
Power Rating at 70℃ | 1/20W | 1/16W | 1/10W | 1/8W | 1/4W | 1/3W | 3/4W | 1W | |
Max RCWV | 25V | 50V | 75V | 150V | 200V | 200V | 200V | 200V | |
Max Overload Voltage | 50V | 100V | 150V | 300V | 400V | 500V | 500V | 500V | |
Jumper<50m ohm | 0.5A | 1A | 1A | 2A | 2A | 2A | 2A | 2A | |
Operating Temperature Range | -55~+155℃ | ||||||||
Standard Resistance Range | 0Ω | 0~50mOhm | |||||||
| ±1%(E-96) | 1ohm~10M ohm | 1ohm~10M ohm | |||||||
| ±5%(E-24) | 1ohm~10M ohm | 1ohm~22M ohm | |||||||
| ITEM | SPECIFICATIONS | TEST METHOD |
Solderability | Over 95%of termination must be covered with solder | JISC52014.17/MIL-STD-202G METHOD 208H/ IEC 60115-14.17 Reflow Soldering:Bath temperature:(235±5)℃,Immersion time:(2±0.5)s WAVE Soldering:Bath temperature:(270±10)℃,Immersion time:(2±0.5)s |
Resistance to Solder Heat | J:△R≤±(1%+0.05Ω) F:△R≤±(0.5%+0.05Ω) No mechanical damage | JISC52014.18/MIL-STD-202GMETHOD 210F/ IEC 60115-14.18 The temperature of the solder bath shall be (260±5)℃,The immersion time shall be(5±0.5)s or(10±1)s as prescribed by the detail specification |
Temperature Coefficient of Resistance (TCR) | (0402&0201): 1Q~10Ω;>3.3M:±400ppm/℃ 10Ω(excluding 10Ω)~3.3M: ±200ppm/℃ (0603 or above): 1Q~10Ω;>1M:±200ppm/℃ 10Ω(excluding10Ω)~1M: ±100ppm/℃ | JISC52014.8/MIL-STD-202G METHOD 304/ IEC 60115-14.8 The temperature characteristic or temperature coefficient of resistance is not specified for resistance values of less than 5R owing to difficulty of accurate measurement |
Short Time Overload | J:△R≤±(2%+0.05Ω) F:△R≤±(1%+0.052) | JISC52014.13/IEC 60115-14.13 2.5×Rated voltage or Max.Overload Voltage for 5 sec. measure resistance after 30 minutes |
Load Life Humidity | J:△R≤±(3%+0.05Ω) F:△R≤±(1%+0.05Ω) | JISC52014.24/MIL-STD-202G Method 106G/ IEC 60115-14.24 Maintain the temperature of the resistor at 40±2℃ and 90～95% RH with the rated voltage applied.Cycle ON for 1.5 hours and OFF for 0.5 hour for1000+48/-0 hours.After 1～4 hour,measure the resistance value. |
Load Life | J:△R≤±(3%+0.05Ω) F:△R≤±(1%+0.05Ω) | JISC52014.25/MIL-STD-202G Method 108A/ IEC 60115-14.25 70±2℃,Max.working voltage for 1000 hrs with 1.5 hrs "ON"and 0.5 hrs “OFF". |
Temperature Cycle | J:△R≤±(1%+0.05Ω) F:△R≤±(0.5%+0.05Ω) No mechanical damage | JISC52014.19/MIL-STD-202G Method 107G/ IEC 60115-14.19 Repeat 5 cycles as follows -65℃(30 min.)+25℃(2～3 min.)+125℃ (30 min.)+25℃(2～3 min.) |
Insulation Resistance | Between termination and coating must be over 1000MQ | JISC52014.6/MIL-STD-202G Method 302/ IEC 60115-14.6 Test voltage:100±15V |
| JISC52014.33/MIL-STD-202G Method 211A/ | ||
| J:△R≤±(1%+0.05Ω) | IEC 60115-14.33 | |
| Bending | F:△R≤±(0.5%+0.05Ω) | Resistance change after bended on the 90mm PCB. |
| Strength | No mechanical damage | Bend:3mm for 0201、0402、0603、0805、1206、1210 2mm for 2010、2512 |
